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Wire Bonding Inspection Equipment WB-3D SMT Equipment WEBER 3D AOI

Dongguan Kingfei Technology Co.,Limited
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    Buy cheap Wire Bonding Inspection Equipment WB-3D SMT Equipment WEBER 3D AOI from wholesalers
     
    Buy cheap Wire Bonding Inspection Equipment WB-3D SMT Equipment WEBER 3D AOI from wholesalers
    • Buy cheap Wire Bonding Inspection Equipment WB-3D SMT Equipment WEBER 3D AOI from wholesalers
    • Buy cheap Wire Bonding Inspection Equipment WB-3D SMT Equipment WEBER 3D AOI from wholesalers
    • Buy cheap Wire Bonding Inspection Equipment WB-3D SMT Equipment WEBER 3D AOI from wholesalers
    • Buy cheap Wire Bonding Inspection Equipment WB-3D SMT Equipment WEBER 3D AOI from wholesalers

    Wire Bonding Inspection Equipment WB-3D SMT Equipment WEBER 3D AOI

    Ask Lasest Price
    Brand Name : KINGFEI
    Payment Terms : T/T, Western Union, MoneyGram
    Supply Ability : 100000pcs
    Delivery Time : within 1~5days
    Model Number : WB-3D
    • Product Details
    • Company Profile

    Wire Bonding Inspection Equipment WB-3D SMT Equipment WEBER 3D AOI

    Wire bonding inspection equipment SMT Equipment WEBER 3D AOI

    Equipment Characteristics
    1.High-density marble platform provides assurance for high-precision
    2.Multi-angle light sources combined with high-resolution cameras and telecentric lenses greatly enhance detection results
    3.The latest self-developed AAM absolute precision measurement system,accurately detects wire aluminum and wire bonding defects
    AI Detection System
    Trainning images}}AI deep neural network}}AI model}}Test results
    ^^^
    Products to be inspected
    3D Detectlon
    1.Having complete WB 3D imaging capability
    2.Multi-layer focusing function,infinite depth of field,clear imaging across the entire board
    3.Zero-negative sample AI detection,exclusive in the industry,complex appearance defect capability

    EQUIPMENT PARAMETERS

    ModelWB-3D
    Vision systemCameraStandara:1200w;Optional:2100W/6500W
    Resolution2.7μm/1.8μm
    FOV size11mm*8.25mm
    IIIuminationRGBW LED
    HardwarePower Supply200V-230V AC50/60Hz
    Power2.2KW
    Pressure0.4-0.6MPa
    Weight1100kg
    Equipment sizeW1156*D1475*H1650
    Check specificationsSubstrate size50*50~510*460mm
    PCB thickness0.6~6mm
    Measure heightComponents measurable up to a maximum height of 30mm
    Optional functionArtificial intelligenceALBig Data Training Center
    Auxiliary functionRemote centralized review,Barcode reading,OCR recognition
    Inspection itemsAppearance inspectionBad wire arc,bad solder joints,oxidation pollution,foreign matter,scratches......

    Quality Wire Bonding Inspection Equipment WB-3D SMT Equipment WEBER 3D AOI for sale
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