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K9F4G08U0D-SIB0 Samsung Chip Component Assembled SMT Machine Parts

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    Buy cheap K9F4G08U0D-SIB0 Samsung Chip Component Assembled SMT Machine Parts from wholesalers
     
    Buy cheap K9F4G08U0D-SIB0 Samsung Chip Component Assembled SMT Machine Parts from wholesalers
    • Buy cheap K9F4G08U0D-SIB0 Samsung Chip Component Assembled SMT Machine Parts from wholesalers
    • Buy cheap K9F4G08U0D-SIB0 Samsung Chip Component Assembled SMT Machine Parts from wholesalers
    • Buy cheap K9F4G08U0D-SIB0 Samsung Chip Component Assembled SMT Machine Parts from wholesalers

    K9F4G08U0D-SIB0 Samsung Chip Component Assembled SMT Machine Parts

    Ask Lasest Price
    Brand Name : Samsung
    Model Number : K9F4G08U0D-SIB0
    Payment Terms : T/T, Western Union, MoneyGram
    Supply Ability : 1000pcs
    Delivery Time : within 3days
    • Product Details
    • Company Profile

    K9F4G08U0D-SIB0 Samsung Chip Component Assembled SMT Machine Parts

    K9F4G08U0D-SIB0 Samsung Chip Component Assembled


    Detail Information:

    1, Part Name: Chip Component

    2, Model:K9F4G08U0D-SIB0

    3, Brand: Samsung

    4, Condition: Original New

    5, Origin: Korean

    • Manufacturer Part Number:

      K9F4G08U0D-SIB0000

    • Rohs Code:

      Yes

    • Part Life Cycle Code:

      Obsolete

    • Package Description:

      12 X 20 MM, 0.50 MM PITCH, HALOGEN AND LEAD FREE, PLASTIC, TSOP1-48

    • Manufacturer:

      Samsung Semiconductor

    • Risk Rank:

      5.84

    • Access Time-Max:

      25 ns

    • Command User Interface:

      YES

    • Data Polling:

      NO

    • JESD-30 Code:

      R-PDSO-G48

    • Length:

      18.4 mm

    • Memory Density:

      4294967296 bit

    • Memory IC Type:

      FLASH

    • Memory Width:

      8

    • Number of Functions:

      1

    • Number of Sectors/Size:

      4K

    • Number of Terminals:

      48

    • Number of Words:

      536870912 words

    • Number of Words Code:

      512000000

    • Operating Mode:

      ASYNCHRONOUS

    • Operating Temperature-Max:

      85 °C

    • Operating Temperature-Min:

      -40 °C

    • Organization:

      512MX8

    • Package Body Material:

      PLASTIC/EPOXY

    • Package Code:

      TSOP1

    • Package Equivalence Code:

      TSSOP48,.8,20

    • Package Shape:

      RECTANGULAR

    • Package Style:

      SMALL OUTLINE, THIN PROFILE

    • Page Size:

      2K words

    • Parallel/Serial:

      PARALLEL

    • Peak Reflow Temperature (Cel):

      NOT SPECIFIED

    • Power Supplies:

      3/3.3 V

    • Programming Voltage:

      3.3 V

    • Qualification Status:

      Not Qualified

    • Ready/Busy:

      YES

    • Seated Height-Max:

      1.2 mm

    • Sector Size:

      128K

    • Standby Current-Max:

      0.00005 A

    • Subcategory:

      Flash Memories

    • Supply Current-Max:

      0.03 mA

    • Supply Voltage-Max (Vsup):

      3.6 V

    • Supply Voltage-Min (Vsup):

      2.7 V

    • Supply Voltage-Nom (Vsup):

      3.3 V

    • Surface Mount:

      YES

    • Technology:

      CMOS

    • Temperature Grade:

      INDUSTRIAL

    • Terminal Form:

      GULL WING

    • Terminal Pitch:

      0.5 mm

    • Terminal Position:

      DUAL

    • Time@Peak Reflow Temperature-Max (s):

      NOT SPECIFIED

    • Toggle Bit:

      NO

    • Type:

      NAND TYPE

    • Width:

      12 mm

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